SST Components, Inc. dba VPT Components Semiconductor Assembly-Test-Environmental Services Over 50 Years Servicing the Microelectronics Industry
SST Components, Inc. dba VPT ComponentsSemiconductor Assembly-Test-Environmental ServicesOver 50 Years Servicing the Microelectronics Industry

Custom Semiconductor Hybrid and Monolithic Assembly

SST Components offers a wide range of micro-electronic assembly options from single die assemblies to Multi chip modules, from single and low quantity prototypes to high volume production runs. Solid State Testing offers the most flexibility for your micro-electronic assembly needs. 


Our manual die mount and wire bond line gives us the capability to create the exact part you need. Our automatic programmable wire bonders give you the repeatability that high production runs require. In process integrity tests include bond pull, ball shear and die shear.

Rf Modules



Auto Bond

Wire Bond


Assembly Services

Component Attach:

  • Die, IC's, Substrates, COB Assemblies
  • Epoxy paste, Film and Preform
  • Conductive & Non-Conductive Adhesives
  • Eutectic, Solder and Hot Gas

Wire Bond:

  • Automatic & Manual
  • Gold Ball from .0007"-.002" 
  • Gold Wedge and Ribbon 
  • Aluminum Wedge from .001"-.020"


Hermetic Sealing:

  • Solder Reflow
  • Seam Seal
  • Cap Weld


  • Encapsulation-Potting
  • Epoxy Seal
  • Bond Pull
  • Die Shear 
  • Hand Soldering
  • Ball Shear 
  • Die-Wafer Inspection 
  • Feed-thru Installation
  • Thermo-Electric Spot Welding
  • Plasma clean
  • Connector Installation
  • Cleaning-Degreasing

SST Components has a wide assortment of semiconductor Assembly, Test and Environmental services, if what you are looking for is not listed; please contact our sales department utilizing our CONTACT US page to discuss your specific requirements.