Solid State Testing offers a wide range of micro-electronic assembly options from single die assemblies to Multi chip modules, from single and low quantity prototypes to high volume production runs. Solid State Testing offers the most flexibility for your micro-electronic assembly needs. 

Our manual die mount and wire bond line gives us the capability to create the exact part you need. Our automatic programmable wire bonders give you the repeatability that high production runs require. In process integrity tests include bond pull, ball shear and die shear.

Solid State Testing has a wide assortment of semiconductor Assembly, Test and Environmental services, if what you are looking for is not listed; please contact our sales department utilizing our CONTACT US page to discuss your specific requirements.