
We provide tin/lead hot solder dip of various package syles. Solder composition is 63% tin/37% lead.

We offer marking services. Standard marking ink is Markem 7261 in customer choice of color. Other ink types are available on request.
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We offer visual inspection services for devices and die. Available magnifications from 1X up to 700X. Inspections are performed to the critiera specified in MIL-STD-883, method 2017 for hybrids or 2010 for monolithic devices or per customer-specified criteria.

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