The Solid State Testing assembly operation actively pursues solutions to the problem of diminishing source circuits (manufacturer discontinued circuits) and can provide custom assembly of microcircuits and hybrids to your requirements.
 All assembly is performed in our new class 10,000 cleanroom by our expert assembly team.
Engineering support is available, should you encounter problems with your package design.
The cleanroom is climate controlled & particle counts are taken weekly. An ESD control program is in force to prevent device damage at all stages of processing from receipt to shipment.
- Eutectic
- Hot gas
- Non-conductive adhesives
- Conductive adhesives
- Film epoxies
Thermosonic or ultrasonic bonding:
- Gold ball
- Gold or aluminum wedge
- Gold ribbon
Wire sizes: .7, .001, .00125, .00150, .0020, .005, .010, .020 inch
Hermetic methods:
- Solder reflow
- Cap weld
- Seam seal
- Glass frit
Non-hermetic methods:
- Epoxy lid seal
- Encapsulation (potting)
- ceramic DIP
- J lead
- Gull wing
- Micro X or T
- LCC
- SOT
- TO can
- Flat pack
- PGA
- COB (chip-on-board)
- various hybrid packages
To assure the quality of our work, our die attach and bonding processes are monitored throughout the day and our high power microscope allows us to visually inspect during processing at magnifications up to 700X.
Click to Contact our Sales Dept. If you don't see what you need, just ask. We are constantly updating our facilities and equipment.
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